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Minimizing Impacts to an Electronic System by Sensing Electrostatic Build-up Prior to an ESD Event

IP.com Disclosure Number: IPCOM000248568D
Publication Date: 2016-Dec-19
Document File: 2 page(s) / 47K

Publishing Venue

The IP.com Prior Art Database

Abstract

Described is a method for minimizing impacts to an electronic system by sensing electrostatic build-up prior to an ESD event.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 54% of the total text.

1

Minimizing Impacts to an Electronic System by Sensing Electrostatic Build -up Prior to an ESD Event

Although today's interfaces typically have error correction or a CRC-type mechanism built into

the protocol, an electrostatic discharge is capable of corrupting more data than can be corrected

or detected within specified standards. Data loss within a transmission channel is also possible

with this type of discharge event.

In a typical system design, there is a conductive shield around the electronics to keep

static discharges away from the driver to receiver path. This same "shield" would also aid in

keeping radiated emissions from escaping the system and potentially interfering with other

electronics or even being "snooped" by others. In cases where active interfaces are subject to

potentially large ESD fields and/or discharge.,there is a concern regarding data integrity and/or

loss. In typical system's cable ports, airflow inlets/outlets, etc., are pathways to allow potentially

high voltages to propagate into the interior of the system and perhaps causing an electrical fault.

Hence, much effort is spent inserting additional shield components, bleed resistors, filters, and

the like around areas which might be pathways into the system.

Another design consideration includes the ability to do concurrent maintenance on the

system (repair/replace functions while the system is still operating). The shield, as known, is

opened (compromised) and components possibly at different potentials are replaced within the

system. Even though static dissipation packaging, wrist straps, etc., may be used, there are still

plenty of opportunities to have significant voltage discharges and, hence, the likelihood of

misinterpreted data transfers (errors).

Even if the circuitry is not damaged with the levels of static voltage associated with

charge build-up within an electronic enclosure, the nature of today's interfaces are driving toward

less and l...