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Vanishing Electronics on Polymeric Substrates

IP.com Disclosure Number: IPCOM000248576D
Publication Date: 2016-Dec-20
Document File: 2 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for dissolving a functioning computer chip or sensor by using a functioning electronic device on a polymer substrate to cause the chip or sensor to self-dissolve on demand.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 70% of the total text.

1

Vanishing Electronics on Polymeric Substrates

Several applications could benefit from having a functioning computer chip or sensor vanish into the surroundings [1].

Current solutions are cumbersome and leave fragments on the micro-scale or larger. One solution is to mount the electronic chip on stressed glass and then, when desired, crack the glass into micro-scale fragments, taking the chip with it. The drawbacks to this are the presence of fragments of the trigger that initiated the glass cracking and the fragment size is on the order of microns (likely larger due to the thickness of the glass required ~ 100 um).

Another solution is to dissolve the chip in a liquid or gas solvent (e.g., acid or water). This solution requires the integration of the functioning electronic and the liquid or hazardous gas. The hazardous gas disqualifies this solution from applications in which the goal is to be eco-friendly (e.g., dissolve a biosensor at its end of life). The liquid integration disqualifies the system from applications in low-pressure environments such as space or vacuum.

A solution is sought that consists of functioning electronics that self-dissolve on command.

The novel solution consists of using a functioning electronic device on a polymer substrate. The electronics are built on one side of the polymer. There are through-substrate vias leading to the backside, which is coated with a reactive multilayer. The reactive multilayer is ignited upon demand through the through-s...