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Novel Integration Approach for BEOL via Chamfer Improvement

IP.com Disclosure Number: IPCOM000248988D
Publication Date: 2017-Jan-25
Document File: 2 page(s) / 179K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed in an integration approach for back-end-of-line (BEOL) via chamfer improvement. The key feature of the solution is a partial trench open for an improved via chamfer profile.

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Title Novel Integration Approach for BEOL via Chamfer Improvement Abstract Disclosed is an integration approach for back-end-of-line (BEOL) via chamfer improvement. The key feature of the solution is a partial trench open for an improved via chamfer profile. Problem A method is needed to improve via chamfer control with trench first integration. Existing methods produce fang-out with overlay (OVL) margin and HVS fails. Via time dependent dielectric breakdown TDDB is a reliability concern for metal-via shorts. Figure 1: Illustration of the problem

Solution/Novel Contribution The novel contribution is an integration approach for back-end-of-line (BEOL) via chamfer improvement. The key feature of the solution is a partial trench open for an improved via chamfer profile. Method/Process

Figure 2: Process flow of proposed solution

Advantages over Previous Solutions This approach provides an improved via chamfer profile, better reliability, and reduced Copper (Cu) gouging. In addition, it eliminates fanging, provides better parametric control, and improves via to underline metal short and via TDDB. Further, the solution provides better OVL process control margin requirements. Figure: Comparison and benefit over process on record (POR)