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Data Generation for Fabricating Unique Chips Using a Charged Particle Multi-Beamlet Lithography System

IP.com Disclosure Number: IPCOM000249287D
Publication Date: 2017-Feb-15
Document File: 120 page(s) / 5M

Publishing Venue

The IP.com Prior Art Database

Abstract

A computer-implemented method for generating beamlet control data (2009) for controlling a maskless pattern writer to expose a wafer for creation of electronic devices using a maskless lithographic exposure system using a maskless pattern writer such that exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of structures for different subsets of the electronic devices, the method comprising receiving design layout data (3021B) defining a plurality of structures for the electronic devices to be manufactured from the wafer; receiving selection data (2004) defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices; and generating (3034) the beamlet control data based on the received design layout data and the received selection data.

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DATA GENERATION FOR FABRICATING UNIQUE CHIPS USING A CHARGED

PARTICLE MULTI-BEAMLET LITHOGRAPHY SYSTEM

TECHNICAL FIELD

5 [0001] The invention relates to a computer-implemented method for generating beamlet

control data for controlling a maskless pattern writer to expose a wafer for creation of

electronic devices. The invention also relates to a computer-implemented method for

generating selection data used in the generation of the beamlet control data. More

specifically, the invention relates to the fabrication of unique chips using a charged particle

10 multi-beamlet lithography machine. The invention further relates to data processing systems,

computer program products and computer-readable storage media related to the computer

implemented methods.

BACKGROUND ART

15 [0002] In the semiconductor industry, lithography systems are used to create, i.e. fabricate

such electronic devices, typically in the form of integrated circuits formed on silicon wafer,

commonly referred to as semiconductor chips. Photolithography utilizes reusable optical

masks to project an image of a pattern representing the desired circuit structures onto a

silicon wafer as part of the manufacturing process. The mask is used repeatedly to image the

20 same circuit structures on different parts of a silicon wafer and on subsequent wafers,

resulting in a series of identical chips being fabricated with each wafer, each chip having an

identical circuit design.

[0003] In contemporary days, various technologies relating to data security, traceability,

and anti-counterfeiting create an increasing need for unique chips having unique circuits or

25 codes, or other unique hardware features for diversification of the chips. Such unique chips

are known and often implement a security related operation in an obfuscated manner

requiring the chip to be truly unique. The known unique chips are typically realized after the

manufacture of a chip, e.g. by manufacturing a series of identical chips using mask based

lithography and then, after manufacture, disrupting certain connections in the chip or by

30 assessing the uniqueness of the chip afterwards upon inspection and control of certain

features. The masks used in this process are expensive to produce, and manufacturing a

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unique mask for each single chip is clearly much too expensive, for which reason mask based

photolithography is considered unsuitable for fabricating unique chips.

[0004] Hence it has been suggested to utilize maskless lithography for the purpose of

creating unique chips. With maskless lithography no mask is used, and instead the required

5 pattern representing the circuit design is input to the maskless lithography system in the form

of a data file such as a GDSII or OASIS file containing the circuit design layout to be

transferred to the target, e.g. wafer, to be exposed by the maskless lithography system.

[0005] A maskless lithography and data input system is disclosed in WO 2010/134026 in

the name of Applicant...