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Exposed die with finger mold for narrow ball pitch

IP.com Disclosure Number: IPCOM000249326D
Publication Date: 2017-Feb-16
Document File: 3 page(s) / 238K

Publishing Venue

The IP.com Prior Art Database

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This is the abbreviated version, containing approximately 55% of the total text.

Exposed die with finger mold for narrow ball pitch

Background

In the current semiconductor technology, the existing finger mold package provides a

substrate strip with ball lands, in which a system interconnect is coupled to the ball lands

through the substrate strip. The cross section view of the existing finger mold package is

shown in Fig. 1. Therefore, it is useful to adopt the finger mold package to form multiple

stacked integrated circuits. For example, in US patent 8,022,538, a method of manufacture of

a base package system is disclosed, which includes forming a substrate strip assembly and

singulating a substrate from the substrate strip assembly.

Fig. 1 the existing finger mold package in the current semiconductor technology

The finger mold package is preferred over other bottom packages for the package-on-package

(PoP) system, because it is easier to control unit warpage with suitable mold volume.

However, the existing finger mold package has an obvious disadvantage of high mold stack-

up, which increases the overall thickness of the package. In the current market trend for

portable electronic devices, the top ball size is required to be smaller and thus the top ball

pitch is narrowed down.

Description

The subject invention discloses a combination of the conventional exposed die technology

and the existing finger mold technology. In this way, the height of mold stack-up and the

thickness of the overall package are reduced by adopting the conventional exposed die

technology.

Fig. 2 the combination of the conventional exposed die and the existing finger mold

The first embodiment of the subject invention is shown in Fig. 3. In Fig. 3(a) of the cross

section view, the exposed die is located on the left side and molded together with a second

component on the right side, such as a wire bonded package, a flip-chip (FC) die or a chip

cap. In Fig. 3(b) of the top view, the exposed die with the finger mold is shown, where two

Exposed die with finger mold for narrow ball pitch

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