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MEMS & Sensor with SR Partition to Prevent Circuit Short

IP.com Disclosure Number: IPCOM000249328D
Publication Date: 2017-Feb-16
Document File: 2 page(s) / 286K

Publishing Venue

The IP.com Prior Art Database

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 53% of the total text.

MEMS & Sensor with SR Partition to Prevent Circuit Short

Background

The integration of microeletromechanical systems (MEMS) with classic CMOS processes has

long been a challenge. Nowadays, with the development of portable devices and the

healthcare industries, MEMS sensor and system-in-package (SiP) module are becoming

smaller, which requires to attach a lid or a seal to a laminated substrate.

However, the package is so small that it is very difficult to place the matrix type of laminated

post and top substrate, because the conductive material, such as solder paste may overflow

and connect to the next signal or functional circuit, which is very likely to cause the short

issue. Currently, the outsourced assembly and test (OSAT) industry solves the problem by

attaching non-conductive material first and then sealing again with solder paste to connect the

top and the bottom with a post or a lid.

Fig. 1 the side view and the top view of a microphone with a ring type laminated post and solder or conductive material

Description

The subject invention discloses a method to prevent the short issue caused by overflow of

solder paste or any other conductive material, by adopting solder resist (SR) partitions

between functional circuits. The structures of the package before assembly and after

assembly are shown in Fig. 2.

Referring to Fig. 2(a), before assembly, three SR partition are attached on the bottom surface

of the top substrate: the first SR partition is on the left edge and over the left ring type

laminate post; the second SR partition is on the right side, over the right ring type laminate

post; and the third SR partition is on right edge and over the right ring type laminate post.

Meanwhile, five SR partitions are attached on the top surface of the bottom substrate: the first

SR partition is on the left edge, over the left ring type laminate post, and further pointing

upward to the first SR partition on the top substrate; the second SR partition is on the left

side, over the left ring type laminate post; the third SR partition is in the middle between the

left and right ring type laminate posts; the fourth SR partition is on the right side, over...