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Easy Detachable Ultra Thin Sub with Carrier

IP.com Disclosure Number: IPCOM000249385D
Publication Date: 2017-Feb-23
Document File: 2 page(s) / 269K

Publishing Venue

The IP.com Prior Art Database

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Easy Detachable Ultra Thin Sub with Carrier

Background

The conventional substrate needs a razor-sharp cutting tool to cut off the cutting area through

the full metal, and release the ultra-thinned substrate from the carrier support after molding.

The substrate strip is therefore susceptible to damage during the detachment processing. In

this proposed invention, substrate has the metal slot feature at cutting position to enable the

cut off and removal of carrier at ease.

Conventional Substrate Design

Figure 1A: Current substrate design with carrier (top view)

Figure 1B: Current substrate design with carrier (cross-sectional view)

Description

The proposed design is to form metal slot in the substrate at its cutting position as shown in

Figure 2A and Figure 2B denoted as cutting area with metal slot.

Figure 2A: Substrate design with metal slot and carrier (top view)

Figure 2B: Substrate design with metal slot and carrier (cross-sectional view)

Easy Detachable Ultra Thin Sub with Carrier

The notion of metal slot composed by dielectric which is brittle, will render the benefits to

detaching and breaking apart of molded substrate from the carrier support entity after cutting

compared to the full metal layer. The carrier together with the corner of substrate remnant is

removed by bending downward to release the substrate as shown in Figure 3A.

Figure 3A:Substrate and carrier separation after cutting

The separation can be enhanced by adding via features as saddled to the substrate a...