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Notched Lid Structure for Component Placement and Increased Module Performance

IP.com Disclosure Number: IPCOM000249451D
Publication Date: 2017-Feb-27
Document File: 2 page(s) / 147K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a notched lid structure that increases the available space for component placement without increasing the TIM1 peeling risk and passive component failure risk.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 63% of the total text.

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Notched Lid Structure for Component Placement and Increased Module Performance

The demand for microelectronic packages to have reduced signal latency and increased speed is increasing. Placing additional passive components (e.g., voltage regulating modules, decoupling capacitors, etc.) on the laminate TSM surface can fulfill this demand. Placing these components on the laminate TSM surface requires additional space, which comes at the expense of decreased space available for seal material. Seal material couples the lid to the laminate and helps in reducing the TIM1 peeling risk. If the amount of seal material is reduced, then the TIM1 peeling strain could increase, which increases the risk for TIM1 peeling. In addition, failure of the passive components during accelerated thermal cycling is a concern. A method is needed that can increase the available space for component placement without increasing the TIM1 peeling risk and passive component failure risk. The solution is a notched lid structure with notches that are either oblong or rectangular with square, pointed, round filleted or depressed corners. The notches are either:

 Open or closed (pocketed) and oriented either randomly within the lid or,  In a radial direction parallel to within 30 degrees to a line extending from the chip/package center to the

chip/package corner This lid structure allows passive component placement and leads to a substantial decrease in TIM1 peeling strain, amounting to over 75%, compared...