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METHOD AND APPARATUS TO UTILIZE ELASTOMER BONDING

IP.com Disclosure Number: IPCOM000249709D
Publication Date: 2017-Mar-23

Publishing Venue

The IP.com Prior Art Database

Abstract

In one embodiment, a downhole device is disclosed, including an alloy substrate, a ceramic layer disposed on the alloy substrate, and a self-reinforced polyphenylene film bonded to the ceramic layer. In another embodiment, a method to provide a downhole device is disclosed, including providing an alloy substrate, applying a ceramic layer to the alloy substrate, and applying a self-reinforced polyphenylene solution to the ceramic layer.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 18% of the total text.

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METHOD AND APPARATUS TO UTILIZE ELASTOMER BONDING

BACKGROUND

Field of the Disclosure

[0001] This disclosure relates generally to elastomer bonding and devices that utilize

the same for downhole applications.

Background of the Art

[0002] Wellbores are drilled in subsurface formations for the production of

hydrocarbons (oil and gas). In many operations it is required to isolate certain zones of

production in downhole locations to facilitate production of oil and gas. Packers are often

utilized to isolate zones of production and can be used in both cased and open hole

applications. Certain packers and other devices can be exposed to corrosive fluids,

requiring the use of nickel alloys and other alloys that can withstand corrosive fluids. Such

packers may not provide sufficient adhesion or retention of elastomeric packing elements

when used with conventional adhesives. It is desired to provide an adhesive that can

allow for sufficient bonding between an elastomeric member and an alloy that can

withstand a corrosive environment.

[0003] The disclosure herein provides elastomer bonding and downhole devices that

utilize the same for downhole applications.

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SUMMARY

[0004] In one aspect, a downhole device is disclosed, including an alloy substrate, a

ceramic layer disposed on the alloy substrate, and a self-reinforced polyphenylene film

bonded to the ceramic layer.

[0005] In another aspect, a method to provide a downhole device, is disclosed,

including providing an alloy substrate, applying a ceramic layer to the alloy substrate, and

applying a self-reinforced polyphenylene solution to the ceramic layer.

[0006] Examples of certain features of the apparatus and method disclosed herein

are summarized rather broadly in order that the detailed description thereof that follows

may be better understood. There are, of course, additional features of the apparatus and

method disclosed hereinafter that will form the subject of the claims appended hereto.

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BRIEF DESCRIPTION OF THE DRAWINGS

[0007]The disclosure herein is best understood with reference to the accompanying

figures, wherein like numerals have generally been assigned to like elements and in

which:

FIG. 1 is a schematic cross sectional diagram of an exemplary downhole system that

includes a downhole device according to embodiments of the disclosure;

FIG. 2 is a schematic diagram of the downhole device according to one embodiment of

the disclosure; and

FIG. 3 is a flow chart illustrating a method to provide a downhole device.

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DESCRIPTION OF THE EMBODIMENTS

[0008] FIG. 1 shows an exemplary embodiment of a downhole system to facilitate the

production of oil and gas. In certain embodiments, system 100 allows for operations to

facilitate production of oil and gas. System 100 includes a wellbore 106 formed in

formation 104 with casing 108 disposed therein.

[0009] In an exemplary embodiment, a wellbore 106 is drilled from a surface 102 to a

downhole location 110. Casing 108 may be disposed within wellbo...