Browse Prior Art Database

Detach Method for Ultra Thin Substrate with Carrier

IP.com Disclosure Number: IPCOM000250206D
Publication Date: 2017-Jun-12
Document File: 3 page(s) / 330K

Publishing Venue

The IP.com Prior Art Database

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 72% of the total text.

Detach Method for Ultra Thin Substrate with Carrier

Background

The existing process to separate substrate from carrier by employing knurling method may

cause potential risk of strip damage since the knurling tool lathed upon substrate few times

till the separation as illustrated in Figure 1A. This proposed invention resorting to cutting

through the substrate at defined area to enable carrier detachment after completion of strip

molding. It is especially appropriate for thin substrate below 100um thickness due to its

flimsiness and brittleness.

Existing Method

Figure 1A: Substrate knurling for carrier detachment

Proposed Method

Figure 1B: Substrate partial cutting for carrier detachment

Description

This proposed invention is having a defined end such as corner of molded substrate with

carrier as partial cut area, literally through the substrate till the carrier interface as shown in

Figure 2A. The alternative modes to perform cutting on partial cut area via mechanical or

laser are further depicted in Figure 2B, 2C and 2D.

Figure 2A: Molded substrate with carrier for partial cutting

Detach Method for Ultra Thin Substrate with Carrier

Figure 2B exhibits the mechanical method using razor-sharp punching cut tool for partial

cutting at defined partial cut area.

Figure 2B: Partial cut using punching tool

Figure 2C exhibits the mechanical method using dicing blade for partial cutting at defined

partial cut area.

Figure 2C: Partial cut using dicing blade

Figure 2D exhibits the laser...