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Partitioning Lid Exposure by FAM

IP.com Disclosure Number: IPCOM000250235D
Publication Date: 2017-Jun-15
Document File: 2 page(s) / 243K

Publishing Venue

The IP.com Prior Art Database

Abstract

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Partitioning Lid Exposure by FAM

Background

The compartment shielding shows in Figure 1A is resorting to the metal wall for shielding

between or among devices. The laser drill is performed to form the compartment opening,

and the opening is filled by conductive material as metal wall to connect it with the ground

pad on substrate.

This invention in Figure 1B, however, proposed to attach the pre-determined compartment

shield, namely Lid on the substrate to partition the devices of a package. It has the advantages

to reduce the package profile since using pre-determined compartment shield, the process

flow is therefore simplified by getting rid of the laser drilling followed by material filling

processes, and is less costly by using Lid compared to conductive material

Prior Art

Figure 1A: Conductive material wall formation for compartment shielding

Invention Design

Figure 1B: Lid for compartment shielding

Description

The Lid as compartment shield is adhered to the substrate between the flip chip and wire

bond package, which is accomplished through the SMT (surface mount technology) and Lid

attach processes as shown in Figure 2A.

Figure 2A: SMT and Lid Attach

Partitioning Lid Exposure by FAM

The structure is subjected to molding by means of FAM (Film-Assisted Molding) system,

whereby the Lid top surface is exposed after molding as illustrated in Figure 2B.

Figure 2B: Film-Assisted Molding

After the structure is singulated into package form as presented in Figure 2C, the outer s...