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Hinged Air Baffle for SAS Card Adapted M.2 Cards

IP.com Disclosure Number: IPCOM000250358D
Publication Date: 2017-Jul-05
Document File: 4 page(s) / 641K

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The IP.com Prior Art Database

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Hinged Air Baffle for SAS Card Adapted M.2 Cards

Disclosed is a design for a hinged air baffle for a Serial Attached Small Computer System Interface (SAS) card-adapted M.2 cards that can regulate air specifically for M.2 card cooling, but is removable to allow an operator to replace the M.2 cards.

Because of the thermal requirements for M.2 form factor flash storage cards, the air baffle requires a very specific geometry. To remove an M.2 card from an M.2 connector, the card must be rotated up then pulled out of the connector. Because of this, the card interferes with the air baffle; therefore, the air baffle must be removable.

Figure 1: Current design

Figure 2: Current removal method

Below: The cooling concern is the airflow LFM which the different manufactures are projecting needing is much more than typically found inside a server 250-300 LFM.

Figure 3: Thermal simulation results – 400GB

An air baffle is needed that can regulate air specifically for M.2 card cooling, but be removable to allow an operator to replace the M.2 cards.

The novel design is for a hinged air baffle for Serial Attached Small Computer System Interface (SAS) card-adapted M.2 cards.

The hinged design allows accelerated airflow over and past the critical surface components of the M.2 flash memory card components. It maintains an optimum airflow gap height above the flash memory card. The design supports function, independent of whether only one or both M.2 flash memory cards is installed, without the n...