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Method for Covering Circuit Boards and Directing Airflow towards Heat Sinks on the Circuit Boards

IP.com Disclosure Number: IPCOM000250361D
Publication Date: 2017-Jul-05
Document File: 2 page(s) / 224K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method is disclosed for covering circuit boards and directing airflow towards heat sinks on the circuit boards by identifying locations of the heat sinks and connectors on the circuit board.

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This is the abbreviated version, containing approximately 100% of the total text.

1

Method for Covering Circuit Boards and Directing Airflow towards Heat Sinks on the Circuit Boards

Components on circuit boards are easily prone to physical damages by external objects such as, but not limited to, hardware tools and screws. Also, circuit boards contain high voltage components that are dangerous to users. There exist a need for protecting the circuit boards containing fragile components from hardware damages and providing more airflow for cooling the heat sinks on the circuit boards.

Disclosed is a method for covering circuit boards and directing airflow towards heat sinks on the circuit boards. The method facilitates identifying locations of the heat sinks and connectors using text markings that are printed on the circuit board. Subsequently, the text markings on the circuit board are utilized for identifying locations of the heat sinks and strategically directing airflow towards the heat sinks that needs to be cooled, as shown in figure 1.

Figure 1

Figure 2, illustrates the strategic airflow towards the heat sinks placed on the circuit board.

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Figure 2

Advantageously, the method facilitates protection of fragile components from physical damages by completely covering the circuit board.

Thus, the method provides an effective technique for protecting fragile components and directing strategic airflow for cooling the heat sinks on circuit board.