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Method and System for Improving Electrical Contact and Reliability of Compliant Pin

IP.com Disclosure Number: IPCOM000250363D
Publication Date: 2017-Jul-05
Document File: 3 page(s) / 155K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method and system is disclosed for improving electrical contact and reliability of compliant pin.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 52% of the total text.

1

Method and System for Improving Electrical Contact and Reliability of Compliant Pin

In general, contact pins are used to create an electrical connection between components and a Printed Circuit Board (PCB) by utilizing a solder and flux to effectively wet into the PCB. The solder flux and solder wave process utilized for insertion of contact pins into the PCB have undesirable effects such as, but not limited to, signal integrity, corrosion, cost and repeatability. Alternatively, a compliant pin is used because of cost and ease usage process. However, contamination and process expense are more during usage of the compliant pin. However, typical compliant pins are provided with quality issues as there is a decrease in size and small compliant pins easily lose contact and barrel force. So there exist a need for method and system for improving electrical contact and reliability of the compliant pin.

Disclosed is a method and system for improving electrical contact and reliability of compliant pin. The method and system utilizes two compliant pins to solder components to the PCB. The two compliant pins are added with an additional material into an eyelet, which is molded at one end of each compliant pin as illustrated in figure 1.

Figure 1

The material additionally used in the eyelet can be, such as, but not limited to, low melt solder, phase change conductive material, electrically conductive adhesive, micro- capsules containing highly conductive liquid, and micro-capsules containing high conductive reactant materials. Subseque...