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Showing 11 - 20 of 313 results
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  1. 11.
    Disclosed is a method for real-time special illumination of three-dimensional (3-D) polygonal objects using a simplified ray-tracing technique. Benefits include improved functionality, improved performance, and improved ease of implementation.
    IPCOM000021647D 2004-Jan-28
  2. 12.
    Disclosed is a method for attaching a heatsink to a heat spreader. Benefits include improved functionality and improved reliability.
    IPCOM000021645D 2004-Jan-28
  3. 13.
    Disclosed is a method for a metal frame support for a Joint Electronic Devices Engineering Council (JEDEC) standard plastic tray. Benefits include improved performance
    IPCOM000021644D 2004-Jan-28
  4. 14.
    Disclosed is a method for non-photolithography circuit formation using xerography patterning. Benefits include improved yield and improved cost effectiveness.
    IPCOM000021643D 2004-Jan-28
  5. 15.
    Disclosed is a method for a polymer-backed die overhang for stacked CSP packaging. Benefits include improved functionality and improved performance.
    IPCOM000021642D 2004-Jan-28
  6. 16.
    Disclosed is a method for a hand tool for cable installation. Benefits include improved functionality, improved ergonomics, and improved yield.
    IPCOM000021641D 2004-Jan-28
  7. 17.
    Disclosed is a method for a compressed port pitch, triple stack audio connector. Benefits include improved functionality and improved ease of manufacturing.
    IPCOM000021640D 2004-Jan-28
  8. 18.
    Disclosed is a method for a double-ended contact integrated circuit (IC) socket. Benefits include improved functionality and improved reliability.
    IPCOM000021639D 2004-Jan-28
  9. 19.
    Disclosed is a method for reinforced wire bonds. Benefits include improved functionality and improved performance.
    IPCOM000021638D 2004-Jan-28
  10. 20.
    Disclosed is a method for attaching an integrated heater spreader (IHS) to an IC package utilizing a Cu carrier plate. Benefits include elimination of substrate carrier and reduction in manufacturing cost.
    IPCOM000021637D 2004-Jan-28