Showing 1 - 10 of 340 from December 2005
Browse Prior Art Database
  1. 1.
    In a manufacturing environment, RFID technology can be used to improve the process of making changes in equipment and materials for a grade change or other change in operation. Such changes are typically made according to a predetermined “recipe” that identifies the various hardware settings and raw materials that are...
    IPCOM000132653D | 2005-Dec-31
  2. 2.
    In a manufacturing environment, RFID technology can be used to improve the process of making changes in equipment and materials for a grade change or other change in operation. Such changes are typically made according to a predetermined “recipe” that identifies the various hardware settings and raw materials that are...
    IPCOM000132652D | 2005-Dec-31
  3. 3.
    Customers of drive-through fast food outlets often face the challenge of eating food without a convenient and rapid means of cleaning the hands prior to eating. Drive-through dispensing of food or dispensing of ready-to-eat food in general could be enhanced by routinely adding a convenient means of washing or...
    IPCOM000132651D | 2005-Dec-31
  4. 4.
    IPCOM000132650D | Original Publication Date: 2005-Dec-30
  5. 5.
    IPCOM000132649D | Original Publication Date: 2005-Dec-29
  6. 6.
    Disclosed is a method for early measurement of high-speed strip-line impedance circuitry. Benefits include improved functionality and improved performance.
    IPCOM000132648D | 2005-Dec-28
  7. 7.
    Disclosed is a method for package-level integrated electromagnetic absorbing adhesive for radio frequency (RF) packaging. Benefits include improved functionality and improved performance.
    IPCOM000132647D | 2005-Dec-28
  8. 8.
    Disclosed is a method for designing and attaching a fan shroud to CPU heat sink. Benefits include improved performance, improved reliability, improved ease of installation, and improved cost effectiveness.
    IPCOM000132646D | 2005-Dec-28
  9. 9.
    Disclosed is a method for package corner stress mitigation features and bend-line management. Benefits include improved functionality, improved performance, improved reliability, and improved cost effectiveness.
    IPCOM000132645D | 2005-Dec-28
  10. 10.
    Disclosed is a method for improved solder joint reliability of pads with microvias. Benefits include improved functionality, improved performance, improved reliability, and improved ease of manufacturing
    IPCOM000132644D | 2005-Dec-28