Month of August 2017 - Page Number 4

Showing 31 - 40 of 233 from August 2017
Browse Prior Art Database
  1. 31.
    IPCOM000250745D | 2017-Aug-29
  2. 32.
    IPCOM000250744D | 2017-Aug-29
  3. 33.
    An heatsink, or thermal exchange device for printed circuit boards, in particular high-power, high density boards. The heatsink comprises a plurality of parallel fins or protrusion, directly soldered on a metallized area of the board. Preferably, the board is an Insulated Metal Substrate board (IMS-PCB) with a...
    IPCOM000250743D | 2017-Aug-29
  4. 34.
    IPCOM000250742D | 2017-Aug-29
  5. 35.
    IPCOM000250741D | 2017-Aug-29
  6. 36.
    IPCOM000250740D | 2017-Aug-29
  7. 37.
    IPCOM000250739D | 2017-Aug-29
  8. 38.
    IPCOM000250738D | 2017-Aug-29
  9. 39.
    IPCOM000250737D | 2017-Aug-29
  10. 40.
    IPCOM000250736D | 2017-Aug-29