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The IP.com Prior Art Database
Disclosed is a technique for packaging large number of devices (chips) in close proximity.
United States
English (United States)
Clip Connected Multi-Module Carrier
Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.
Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.
Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110 are electrically connected to the power supply and signal wiring. Clip 130 is electrically connected to pad 110 by solder 120. Clip 130 is elastic and electrically conductive. Clip 130 may be formed from beryllium copper, or other elastic and electrically conductive materials.
Module 140 has a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wire 160A is routed near an edge of module 140. Wire 160B is routed (not shown) near the same edge as wire 160A. Wires 160A and 160B may be formed from copper or other conductive materials. Wirebonds 170A and 170B may be formed from gold, aluminum, or other conductive materials.
Module 140 is electrically connected to carrier 100 by clip 130. The upper edge of clip 130 is elastic and deforms slightly to accommodate module 140, wipes wire 160A during module 140 insertion for better electrical contact, and remains in electrical contact with wire 160A after insertion is complete. The lower edge of clip 130 is elastic and deforms slightly during module 140 insertion, and remains in physical contact with module 140 after insertion is complete. Cavity 145 may be filled with filler 180 to environmentally protect die 150 from contamination and handling damage.
