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Clip Connected Multi-Slotted-Module Carrier with Heat Sink Disclosure Number: IPCOM000004387D
Publication Date: 2000-Oct-30
Document File: 2 page(s) / 192K

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Disclosed is a technique for packaging large number of devices in close proximity.

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This is the abbreviated version, containing approximately 90% of the total text.

Clip Connected Multi-Slotted-Module Carrier with Heat Sink

Packaging a large number of devices (chips) in close proximity has become feasible because of the low power dissipation and high reliability of CMOS technology. The close proximity of devices reduces propagation delays, which enables higher speed system operation. The low power dissipation enables dense packing of devices for small lightweight products, which can still be cooled by conventional means. Relatively low power semiconductor dice (chips) require minimum packaging. Disclosed is a technique for packaging large number of devices in close proximity.

Figure 1 is a cross section of a carrier/module assembly consisting of a carrier and one or more modules. Each module contains one or more semiconductor dice. The module is adapted to physically and electrically attach to the carrier.

Carrier 100 is composed of ceramic or organic insulating material and conductive wires. The wire may be formed from copper or other conductive materials. Carrier 100 contains at least two power supply wires and one or more signal wires, arranged in one or more layers. Pads 110 are electrically connected to the power supply and signal wiring. Clip 130 is electrically connected to pad 110 by solder 120. Clip 130 is elastic and electrically conductive. Clip 130 may be formed from beryllium copper, or other elastic and electrically conductive materials.

Module 140 has a cavity 145 that contains die 150. Die 150 is mechanically attached to the bottom of cavity 145. Die 150 is electrically connected to wires 160A and 160B by wirebonds 170A and 170B. Wire 160A is routed near an edge of module 140. Wire 160B is routed (not shown) near the same edge as wire 160A. Wires 160A and 160B may be formed from copper or other conductive materials. Wires 160A and 160B are contained within the module 140 insulator. A portion of wire 160A is electrically accessible through slot 180 in the module 140 insulator. Slot 170 in the module 140 insulator provides a mechanical connection region. Wirebonds 170A and 170B may be formed from gold, aluminum, or other conductive materials. Thermally conductive plate 200 is molded in the module 140 dielectric and contacts the back of die 150. Heat sink 210 is bonded to module 140 and thermally contacts plate 200. Heat flows from die 150 through plate 200 to fins 220 of heat sink 210. Heat flows from fins 220 to the surrounding air. Thermally conductive thermal compound 230 may be used to enhance thermal conductivity. Plate 200, heat sink 210, and fins 210 may be formed of copper, or other thermally conducting material. Thermal compound 230 is often referred to as thermal grease.

Module 140 is electrically connected to carrier 100 by clip 130. The upper edge of clip 130 is elastic and deforms slightly to accommodate module 140 and electrically contacts wire 160A through slot 180. Slo...