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A Method for SMT Compatible Assembly of Ultra-Thin Die to PWB using a Release Tape with an ACF Planarizer

IP.com Disclosure Number: IPCOM000004574D
Original Publication Date: 2001-Feb-21
Included in the Prior Art Database: 2001-Feb-21
Document File: 3 page(s) / 275K

Publishing Venue

Motorola

Related People

Authors:
Krishna Kalyanasundaram Daniel Gamota Steve Schiefers

Abstract

A Method for SMT Compatible Assembly of Ultra-Thin Die to PWB using a Release Tape with an ACF Planarizer