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Method to Attach Ultra Thin Die to PWB Using a Vacuum Chuck

IP.com Disclosure Number: IPCOM000004590D
Original Publication Date: 2001-Feb-23
Included in the Prior Art Database: 2001-Feb-23

Publishing Venue

Motorola

Related People

Authors:
Andrew Skipor Daniel Gamota Krishna Kalyanasundaram Steve Schiefers

Abstract

Lower semiconductor package thickness and less weight are among the significant benefits of using ultra-thin die. The methodology used today to assemble circuits with ultra-thin die is both time and labor-intensive. A high-volume technique for assembling circuits with ultra-thin die is proposed.