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Environmentally Friendly Structure to Handling Ultra thin Die

IP.com Disclosure Number: IPCOM000004591D
Original Publication Date: 2001-Feb-23
Included in the Prior Art Database: 2001-Feb-23

Publishing Venue

Motorola

Related People

Authors:
Steve Schiefers Daniel Gamota Krishna Kalyanasundaram Andrew Skipor

Abstract

Lower semiconductor package thickness and less weight are among the significant benefits of using ultra-thin die. The methodology used today to assemble circuits with ultra-thin die is both time and labor-intensive. Moreover, it uses solvents that are not environmentally preferred. A high-volume and environmentally preferred technique for assembling circuits with ultra-thin die is proposed.