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Use of a Plug Package Design for mounting semiconductors to circuit boards.

IP.com Disclosure Number: IPCOM000004596D
Publication Date: 2001-Feb-27
Document File: 1 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method of semiconductor component mounting using a die mounted into a plug fixture for insertion into a circuit board receptacle, which enables increased lateral component density from vertical space utilization, and multiple component mounting ability in the same vertical axis.