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Integration of a heat sink (or slug) and lead in a semiconductor component for improved thermal, surge and Rdson characteristics. Disclosure Number: IPCOM000004597D
Publication Date: 2001-Feb-27

Publishing Venue

The Prior Art Database


The lead or leads of a semiconductor device are formed in such a manner as to also act as a heat sink. This same lead/heat sink can be scaled as to provide a large contact area to the die or the die connection(s) area while retaining standard external to the package connection dimensions. Integration of the function of the lead as an electrical connection and heat sink reduces the number of connections typically used in the industry while enabling intimate contact of the heat sink to the die. This reduction of connections, large contact area, and large effective conductor size of the combined lead/heat sink results in numerous benefits over prior art.