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Internally Isolated Tape Packaging Disclosure Number: IPCOM000004625D
Publication Date: 2001-Mar-01

Publishing Venue

The Prior Art Database


This invention relates to semiconductor device packaging, and in particular to a package using the over molded isolation process incorporating an insulator between the die and the heat-sink, although it is applicable to other applications that require voltage isolation and high thermal transfer. The invention disclosed is the use of a tape or film to replace other means of isolation (such as a ceramic) between a semiconductor die and heat-sink. A tape or film with suitable properties for the application is used to attach the heat spreader (die flag) to the heat-sink.