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METHOD TO PREVENT REFLOW OF LOW TEMPERATURE SOLDER PACKAGES

IP.com Disclosure Number: IPCOM000004647D
Publication Date: 2001-Mar-15
Document File: 1 page(s) / 123K

Publishing Venue

The IP.com Prior Art Database

Abstract

A Method is disclosed here that allows lead frame/substrate bond sites to be wire bonded at higher temperatures while the area underneath the die/chip (which can include the die/chip attach material) is at a temperature below the leadframe/substrate bond sites. An example of ( but certainly not limited to) where this method would be useful over existing methods is in a aluminum-copper metal system for copper ball bonding where the typical epoxy Tg and solder reflow levels are lower than the temperature required for copper wire bond.