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A METHOD OF WIRE BONDING SEMICONDUCTOR DEVICES ON METAL FOIL OR TAPE CARRIERS

IP.com Disclosure Number: IPCOM000004652D
Publication Date: 2001-Mar-16
Document File: 1 page(s) / 72K

Publishing Venue

The IP.com Prior Art Database

Abstract

In order to increase package density on a given semiconductor lead frame/carrier, it is necessary to eliminate commonly used mechanical clamping mechanisms. By eliminating the space normally set aside for mechanical clamping systems on lead frame/carriers, additional packages can be built greatly improving utilization of space.