A METHOD OF WIRE BONDING SEMICONDUCTOR DEVICES ON METAL FOIL OR TAPE CARRIERS
Publication Date: 2001-Mar-16
The IP.com Prior Art Database
In order to increase package density on a given semiconductor lead frame/carrier, it is necessary to eliminate commonly used mechanical clamping mechanisms. By eliminating the space normally set aside for mechanical clamping systems on lead frame/carriers, additional packages can be built greatly improving utilization of space.