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The Use Of Potassium Silicate To Promote Sub-oxide Bonding To Solder Glass

IP.com Disclosure Number: IPCOM000004658D
Original Publication Date: 2001-Mar-20
Included in the Prior Art Database: 2001-Mar-20
Document File: 5 page(s) / 336K

Publishing Venue

Motorola

Related People

Authors:
Alan James

Abstract

One vacuum seal system for Field Emission Devices (FED) involves the use of vitreous lead solder glass (frit). Failure analysis of a frit seal problem showed that the decreased seal strength was due to a poor frit bond to the cathode. This prompted an investigation into finding an interim material that would assist in that bond yet would not in itself degrade the vacuum seal integrity. The material used was potassium silicate.