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IP.com Disclosure Number: IPCOM000004677D
Original Publication Date: 2001-Apr-02
Included in the Prior Art Database: 2001-Apr-02

Publishing Venue


Related People

Timothy B. Dean Charles R. Delott Scott D. Serlin


Some components are not easily soldered using typical reflow or waveline processes; these parts are not amenable to batch processing. A program required a method to solder seal a lid on an on-board hermetic enclosure that was incorporated on a substrate meant for a non-hermetic application. The hermetic enclosure was a rectangular solder-coated ring soldered to a substrate. Solder sealing the lid to the enclosure had to be accomplished without subjecting the accompanying components on the substrate to excessive heat. Our solution was to use a stencil or mask with apertures that allowed only the solder on the lids and seal rings to be melted by an IR lamp, thus protecting the surrounding circuitry from excessive heat. This approach selectively soldered only the components that needed to be soldered, and it protected the surrounding circuitry from excessive heat. This paper discusses the use of the selective IR soldering process for an on-board hermetic package.