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OEM-friendly thermal test chip design for flip-chip application

IP.com Disclosure Number: IPCOM000004730D
Publication Date: 2001-Apr-23

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design for an OEM-friendly thermal test chip for flip-chip application. Benefits include improved uniformity of die heating and similarity of electrical current as the final product without requiring a special test board, external power supply or a test-vehicle-specific package substrate.