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Integration retention and clipping mechanism for BGA mounted CPU and chipset cooling

IP.com Disclosure Number: IPCOM000004733D
Publication Date: 2001-Apr-23

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design for an integrated retention and clipping mechanism for BGA mounted, unsocketed CPU and chipset or onboard graphics cooling. Benefits include support for larger cooling solutions for high-powered BGA devices, placement of BGA solder balls in a state of compression after assembly, and the transfer of Z (out of board bottom plane direction) dynamic loads to the retention module instead of the BGA balls.