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Use of a mechanical probe to measure the bond line thickness of grease between the heat sink and die of CPU packages

IP.com Disclosure Number: IPCOM000004756D
Publication Date: 2001-May-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the use of a mechanical probe to measure the bond line thickness (BLT) of grease between the heat sink and die of mobile computer organic land grid array (OLGA) packages. Benefits include faster results without destroying the chip and module board .