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Method for the addition of particulates and/or platelets to solder thermal interface material for enhanced electronic package performance

IP.com Disclosure Number: IPCOM000005052D
Publication Date: 2001-Aug-01

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the addition of particulates and/or platelets to solder thermal interface material for enhanced electronic package performance. Benefits include improved thermal performance and reliability, and improved assembly-line yield.