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Method for using a chemical mechanical polishing tester for quality control analysis/qualifying of polishing pads and slurries

IP.com Disclosure Number: IPCOM000005061D
Publication Date: 2001-Aug-07

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using a chemical mechanical polishing (CMP) tester for quality control (QC) analysis and the qualifying of polish pads and slurries.