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Design for a force-balanced thermal plate for cooling semiconductor devices

IP.com Disclosure Number: IPCOM000005062D
Publication Date: 2001-Aug-07
Document File: 4 page(s) / 3M

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a design for a force-balanced thermal plate for cooling semiconductor devices. Benefits include improved thermal performance and improved flexibility through looser tolerances on the mechanical components while maintaining mechanical integrity.