CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2001-Oct-10
Currently there is a technology available that consists of attaching chip components on the solder F side of a PC. board, and discrete components on the component side of the P.C. Board. (See U.S. patent numbers 4,139,881 and 4,164,778).