SOLDER COATED BALL TO SEAL PLATED THROUGH HOLES IN GLASS PLATE
Original Publication Date: 1983-Mar-01
Included in the Prior Art Database: 2001-Oct-08
When glass plate is used to package electrical components such as pressure transducers, resonators, displays or semiconductors, one of the problems is obtaining hermetic electrical connec. tions through the glass sheet. A logical method is to laser drill or etch holes in the glass and then metallize through the hole. After the glass package is assembled, it can be evacuated through the hole and then sealed by filling the hole with solder. The main problem with this solution is that the solder, having a different coefficient of expansion than the glass causes cracks in the glass during d temperature cycling and/or during cooling of the solder after the initial sealing.