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METAL DEPOSITED MASK FOR IMPROVED ALUMINUM LINE DEFINITION

IP.com Disclosure Number: IPCOM000005537D
Original Publication Date: 1984-Apr-01
Included in the Prior Art Database: 2001-Oct-12

Publishing Venue

Motorola

Related People

Authors:
John S. McDonald James W. Rupnow

Abstract

Two problems often encountered in the use of aluminum metallization on semiconductor devices are hillock formation and "notching" during aluminum etching. These problems are especially severe when the metallization includes very narrow runs. Both problems are reduced by the use of a TiW hard mask for aluminum patterning.