Browse Prior Art Database

METHOD TO AFFIX & WAVE SOLDER IC CARRIERS ON A FLEXIBLE SUBSTRATE

IP.com Disclosure Number: IPCOM000005555D
Original Publication Date: 1985-Oct-01
Included in the Prior Art Database: 2001-Oct-15
Document File: 2 page(s) / 117K

Publishing Venue

Motorola

Related People

Authors:
Jay Miniet

Abstract

The goal of this article is to describe the steps required to affix and wave solder IC carriers on the top side surface of a flexible substrate.