Dismiss
The IQ application will be unavailable on Sunday, November 24th, starting at 9:00am ET while we make system improvements. Access will be restored as quickly as possible.
Browse Prior Art Database

HOT MELT ADHESIVE INTERCONNECT AND ALIGNMENT SYSTEM

IP.com Disclosure Number: IPCOM000005612D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2001-Oct-19

Publishing Venue

Motorola

Related People

Authors:
Frank Juskey Dale Dorinski

Abstract

State-of-the-art electronics assemblies use a conductive hot melt adhesive screened on a flexible mylar or kapton substrate to make board-to-board or board-to-LCD interconnections. While these systems enjoy an order of magnitude reduction in height over standard elastomeric interconnect systems, they do have two ma- jor draw-backs which are, difficulty in alignment and poor peel strength characteristic of hot melt adhesives.