PARALLEL PRINTED CIRCUIT MANIFOLD
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-23
A parallel printed circuit manifold is an equipment design concept that relies on a dual plenum delivery and exhaust system which provides individualized inlet and exhaust ports used by fluid or gas to cool each component of a printed circuit board. When used in forced convection, a significant increase in heat removal capability per unit of fluid flow is obtained for board mounted packages without making restrictions on compo- nent design. This also has the potential of being retrofitted into existing parallel printed circuit board equip- ment designs without numerous tubes or restrictions on repairability.