UNDERCUT CONTROL OF BUMPS IN TAPE AUTOMATED BONDING (TAB)
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-23
A process of plating bumps to control undercut in TAB processing is described. The problems addressed here are two fold. Primarily, there is a physical problem caused by undercutting TAB bumps during processing in that the attachment of the bump to the surface is weakened A secondary problem is the re-sputtering of the titanium-tungsten/titanium-tungsten-nitride (TiWITiWN,) barrier layer on to the bump during reactive ion etching.