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Browse Prior Art Database

UNDERCUT CONTROL OF BUMPS IN TAPE AUTOMATED BONDING (TAB)

IP.com Disclosure Number: IPCOM000005642D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-23
Document File: 1 page(s) / 63K

Publishing Venue

Motorola

Related People

Authors:
George F. Carney Douglas G. Mitchell Ronald M. Lahti

Abstract

A process of plating bumps to control undercut in TAB processing is described. The problems addressed here are two fold. Primarily, there is a physical problem caused by undercutting TAB bumps during processing in that the attachment of the bump to the surface is weakened A secondary problem is the re-sputtering of the titanium-tungsten/titanium-tungsten-nitride (TiWITiWN,) barrier layer on to the bump during reactive ion etching.