A METHOD AND APPARATUS FOR PLANARIZING ALUMINUM WITH AN ELECTRON BEAM GUN
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-24
The present invention discloses a new method for depositing and planarizing aluminum in submicron preohmics having aspect ratios of 1.0 or greater. Typically, electron beam evaporation methods using high rate electron beam guns and exotic planetaries or sputtering methods are used. However, because of the insuffi- cent mobility of the aluminum in these methods, cusping and extremely poor step coverage result.