Browse Prior Art Database

POLYIMIDE PLANARIZATION

IP.com Disclosure Number: IPCOM000005665D
Original Publication Date: 1987-Oct-01
Included in the Prior Art Database: 2001-Oct-24

Publishing Venue

Motorola

Related People

Authors:
J. Foerstner D. Rodgers

Abstract

As part of our ongoing metal backend development work a photoresist problem was noted, which appeared to relate to the lack of planarity associated with the polyimide interlayer structure used.