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MEANS AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS

IP.com Disclosure Number: IPCOM000005696D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2001-Oct-26

Publishing Venue

Motorola

Related People

Authors:
Donald L. Tolliver Jacob A. Schaper

Abstract

There is a need for improved means and methods for cleaning the surfaces of integrated circuit wafers during manufacturing. A variety of different cleaning systems have been developed in the prior art to reduce the level of contamination on silicon wafers. However, with many prior art cleaning systems and methods, con- tamination is actually added to the surface rather than removed.