Browse Prior Art Database

SHIPPING RAIL HAVING CHAMFERS

IP.com Disclosure Number: IPCOM000005699D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2001-Oct-29
Document File: 1 page(s) / 48K

Publishing Venue

Motorola

Related People

Authors:
S. C. Chow L. K. Cheng

Abstract

The shipping rail described is an A-frame type transporting semiconductor devices, such as solder seal packages. Traditionally, shipping rails are constructed with flat inner surfaces which contact the package, par- ticularly the baseortopof the package. Because of the relative movement between shipping rail and packages, the antistatic solutions coating the shipping rail can be transferred to the packages, causing the packages to become discolored. In addition, this contact between the shipping rail and the package can result in enough friction to wear out the antistatic coating.