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IMMERSION DEVELOP RINSE WATER INJECTION PROCESS TO ELIMINATE POSITIVE PHOTORESIST SCUMMING

IP.com Disclosure Number: IPCOM000005700D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2001-Oct-29
Document File: 2 page(s) / 112K

Publishing Venue

Motorola

Related People

Authors:
Paul M. Winebarger

Abstract

A simple modification to a positive resist immersion develop system's dump and fill rinse tank is described which alleviates resist scumming problems. The resist scumming is attributed to the precipitation of dissolved resist and its subsequent adhesion to the wafer surface. The resist precipitation is the result of the rapid change in pH experienced by the exposed positive resist during its transfer from the highly alkaline develop tank to the deionized water dump rinse tank.