SELF-ALIGNED MOAT-METAL DEPOSITION PROCESS
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2001-Oct-30
The process is a simple method for deposition of metal in an etched Si trench using lift-off (see attached Figure for the process flow). It takes advantage of the overhanging lip created from the silicon etch. The photoresist mask is structurally aided by a layer of oxide under the resist that help support the lip. Metal is then blanket deposited, with a subsequent lift-off of the surface metal and resist.