Browse Prior Art Database

COMPLIANT INTERCONNECT METHOD AND STRUCTURE

IP.com Disclosure Number: IPCOM000005754D
Original Publication Date: 1988-Oct-01
Included in the Prior Art Database: 2001-Nov-02

Publishing Venue

Motorola

Related People

Authors:
Bernard Greenstein Ted Grzeskowiak

Abstract

This invention describes a means to reduce thermal shock fatigue using a compliant soldering member. It involves the use of a flex circuit.