Browse Prior Art Database

POST ASSEMBLY MULTI-LAYER INTERCONNECTS FOR FLEXIBLE CIRCUITS

IP.com Disclosure Number: IPCOM000005833D
Original Publication Date: 1990-Mar-01
Included in the Prior Art Database: 2001-Nov-09
Document File: 2 page(s) / 77K

Publishing Venue

Motorola

Related People

Authors:
Keith Soldner Anthony Suppelsa

Abstract

Many electronic circuit applications require a degree of circuit connectivity that is impossible to achieve with a single layer of circuit traces. The conventional approach to obtaining this level of connectivity is the use of multi-layer circuits where multiple layers of circuit traces are sandwiched between insulating layers and connected to each other using a method such as plated thru holes. Implementation of this requires multiple executions of the circuit fabrication process plus the processes required to effect the interconnect between the metal layers (such as drilling and plating).